SMD-IR Type BGA Rework station Soldering Center

SMD-IR Type BGA Rework station Soldering Center is suitable for soldering, picking or reworking BGA, CSP, LGA, QFP, PLCC and BGA attachment. This center owns a stable and safe rework bench, precision optics centering system, the automatically generative software of temperature curve, the heating system controlled by microcomputer. Its design focuses specially on standard or lead-free soldering for different sizes of circuit boards.

Hardware configuration& functions:
1. High precision place system can achieve four-dimension movements from X-Y-Z-β angles.
2. Bidirectional heating system can perform simultaneously the heating from the top of the element and the bottom of the PCB, so that the PCB is avoided to become warping because of an uneven heating. Further, the advanced infrared heating method brings the elements an even heating without exchanging the heating nozzle to save your cost.
3. The infrared heating tube made from carbon fiber, based on the aerospace technology, can operate 5000 hours.
4. The precision optics centering system is composed of a CCD camera, an optical device, 19 inch LCD and so on, so the operator can observe directly the operation. The system realizes to lap the bonding pad of PCB over the pins of placing element together.
5. CCD camera is a kind of digital high definition camera used specially for aerospace technology research. Without adding a plus power supply and an image collection card, the CCD camera can connect with a computer by USB interface, and holds high dynamic performance and definition.
6. Double temperature probes are adopted for SMD-IR type BGA Precision Soldering Center, one probe measures and controls temperature in the heating zone; and the other clings to the soldered element to measure its true temperature, in order to correct the temperature value in the heating zone.
7. This center matches with LCD to show the real-time temperature curves (two curves), temperature values (two sets) and operating time.
8. LCD can show two real-time temperature curves, one curve indicates the temperature in the heating zone, and the other indicates the temperature of the soldered element.
9. This center matches with microcomputer system, so the operator can setup reworking soldering parameters according to the features of element. The temperature curves of the reworking soldering can be generated automatically. Those curves can be saved in the PC to call for using at any time.
10. The center also matches with mini-pump, so that it is unnecessary to add a plus air supply during operation.
11. The center can achieve the soldering, picking and reworking of BGA, CSP, LGA, QFP, PLCC and other IC chips, and BGA ball attachment.

Technical parameters of the center:

Hardware configuration table: